Sealer Mikon® 799 MC and Release Agents from the Mikon® 229 MC series
Efficient composites processing with Mikon®: sealing of microporous mould surfaces and perfect demoulding with Mikon® 799 MC and Mikon® 229 MC series
Optimize your composites moulding processes with our reliable release system: The fast evaporating sealer Mikon® 799 MC helps sealing micropores, while the easy-to-use, semi-permanent release agents of the Mikon® 229 MC series enable flawless removal of the composite piece from the mould. For a smooth production process and high quality surface.
Sealer Mikon® 799 MC
- Fast evaporating solvent-based sealer for porous mould surfaces
- Reliably seals the micropores before applying a semi-permanent release agent from the Mikon® 229 MC series
- Temperature stable up to approx. 450 °C / 842 °F
- Universally suitable for the sealing of new or thoroughly cleaned and repaired moulds with porous surfaces for the processing of thermoset resins (polyester, epoxy and phenolic resins)
Release Agents of the Mikon® 229 MC series
- Ultra-fast evaporating semi-permanent mould release agents based on solvents that are used to release thermoset resins
- Quick and easy handling, do not require polishing (so-called „wipe on, leave on products“)
- Strong release effect
- Temperature stable up to approx. 450 °C / 842 °F
- Manufactured parts have a high-gloss surface finish
- Enable further processing such as gluing or varnishing without additional treatments
- Product family with adjusted, different lubrication properties, ranging from L (low) over M (medium) to H (high) lubrication.
Let yourself be convinced by our proven solutions for composites processing. Contact our experienced and competent team of experts today to discuss your requirements and receive an individual offer.