Water-based semi-permanent mould release agent developed for demanding composite applications. Suitable for both room temperature processing and hot press applications, it delivers clean release performance across a wide temperature range.
- Easy to use – no mould sealing required
- Temperature stable up to 400°C / 752°F
- For epoxy, phenolic, polyester and melamine resins
- No transfer to moulded parts and no build-up on mould surfaces
- Enables downstream processes such as varnishing and gluing without additional treatment
